Generative and hybrid filmmaking (exchange programme)

VIA Film and Transmedia's international semester programme explores new approaches to filmmaking through generative AI and hybrid production methods. The programme combines hands-on experimentation with filmic storytelling, investigating how emerging technologies and live-action filmmaking can expand creative development, visualisation, and production. Description Exploring new creative workflows The creative industries are undergoing rapid transformation as generative AI introduces new ways of developing and producing film. Rather than focusing on fixed methods, the course emphasises exploration and experimentation - investigating how emerging tools can inform and expand film development, visualisation, and production. Working with AI brings renewed attention to core artistic questions such as authorship, control, and intention. Students are encouraged to critically engage with these dynamics while developing their own creative approaches. The course is all about: Embracing new workflows and skills Building an innovative portfolio Exploring the Intersection of AI and Emerging Technologies Engaging in a Creative Learning Environment Read more about the programme here Admission In order to apply, you should have completed at least two years of studies in related areas and be 18 years old or more. Your home institution must have an inter-institutional agreement with VIA University College in order for you to be able to apply for an exchange programme at VIA. If your home institution does not have an exchange agreement with VIA, please contact your international office to learn more about the opportunities. Tuition Exchange students do not pay tuition For Further Information Information from the Danish Agency for Higher Education can be located at http://en.fivu.dk/ You will find information about the Danish assessment of foreign qualifications in Guide to diploma recognition About the Educational System in general visit the section The Danish Higher Education System

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• Осень 2027Подать до 15 апр. 2027 г.Ближайший срок

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